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*AMD . . . . . . . [no datasheets, some info]...
*Chips & Technologies...
*Contaq  . . . . . [no datasheets, some info]...
*Efar Microsystems [no datasheets, some info]...
*ETEQ...
*Faraday...
*Forex . . . . . . [List only, no datasheets found]...
*Intel...
**800 series
***810         (Whitney)       04/26/99...
***810L        (Whitney)       04/26/99...
***810-DC100   (Whitney)       04/26/99...
***810e        (Whitney)       09/27/99...
***810e2       (Whitney)       01/03/01...
***815         (Solano)        06/19/00...
***815e        (Solano-2)      06/19/00...
***815em       (Solano-?)      10/23/00...
***815ep       (Solano-3)      c:Nov'00...
***815p        (Solano-3)      c:Mar'01...
***815g        (Solano-3)      c:Sep'01...
***815eg       (Solano-3)      c:Sep'01...
***820         (Camino)        11/15/99...
***820e        (Camino-2)      06/05/00...
***830M        (Almador)       07/30/01...
***830MP       (Almador)       07/30/01
Chips:         
[82830P] (MCH) [82801CA] (ICH3)
CPUs:          P-III/P-III(T)/Celeron
DRAM Types:    SDRAM PC133 
Mem Rows:      ?
DRAM Density:  64Mbit 128Mbit 256Mbit 512Mbit
Max Mem:       1GB
ECC/Parity:    No
AGP speed:     1x 2x 4x
Bus Speed:     100 133
PCI Clock/Bus: 1/4 PCI 2.2

it supports non-integrated graphics only


***830MG       (Almador)       07/30/01...
***840         (Carmel)        10/25/99...
***845         (Brookdale)     09/10/01...
***845MP       (Brookdale-M)   03/04/02...
***845MZ       (Brookdale-M)   03/04/02...
***845E        (Brookdale-E)   05/20/02...
***845G        (Brookdale-G)   05/20/02...
***845GL       (Brookdale-GL)  05/20/02...
***845GE       (Brookdale-GE)  10/07/02...
***845PE       (Brookdale-PE)  10/07/02...
***845GV       (Brookdale-GV)  10/07/02...
***848P        (Breeds Hill)   c:Aug'03...
***850         (Tehama)        11/20/00...
***850E        (Tehama-E)      05/06/02...
***852GM       (Montara-GM)    01/14/03...
***852GMV      (Montara-GM)    ???...
***852PM       (Montara-GM)    06/11/03...
***852GME      (Montara-GM)    06/11/03...
***854         (?)             04/11/05...
***855GM       (Montara-GM)    03/12/03...
***855GME      (Montara-GM)    03/12/03...
***855PM       (Odem)          03/12/03...
***860         (Colusa)        05/21/01...
***865G        (Springdale)    05/21/03...
***865PE       (Springdale-PE) 05/21/03...
***865P        (Springdale-P)  05/21/03...
***865GV       (Springdale-GV) c:Sep'03...
***875P        (Canterwood)    04/14/03...
*Headland/G2...
**HT12/+/A      Single 286 AT Chip with EMS support            c:Aug90
***Info:...
***Configurations:...
***Features:...
**HT18          80386SX Single Chip                            c:Sep91...
**HT21          386SX/286 Single Chip (20 MHz)                 c:Aug91...
**HT22          386SX/286 Single Chip (25 MHz)                 c:Sep91...
**HT25          3-volt Core Logic for 386SX                    c:Dec92...
**HT35          Single-Chip Peripheral Controller [partial info]     ?...
**HTK320        386DX Chip Set                                 c:Sep91...
**HTK340        "Shasta" 486 Chip Set                          c:Jun92...
**Support Chips:
**HT44          Secondary Cache                                c:Jun92...
**Other:...
*HMC (Hulon Microelectronics)...
*Logicstar...
*Motorola...
*OPTi...
*PC CHIPS/Amptron/Atrend/ECS/Elpina/etc...
*SIS...
*Symphony...
*TI (Texas Instruments)...
*UMC...
*Unresearched:...
*VIA...
**VT82C598MVP  Apollo MVP3,Single-Chip 66/75/83/100MHz & AGP <09/22/97
***Notes:...
***Info:...
***Configurations:...
***Features:
o   AGP / PCI / ISA Mobile and Deep Green PC Ready
    - Supports 3.3V and sub-3.3V interface to CPU
    - Supports separately powered 3.3V (5V tolerant) interface to 
      system memory, AGP, and PCI bus
    - PC-97 compatible using VIA VT82C586B (208-pin PQFP) south bridge 
      chip with ACPI Power Management for cost-efficient desktop 
      applications
    - Modular power management and clock control for mobile system 
      applications
    - Combine with VIA VT82C596 (Intel PIIX4 pin compatible 324-pin 
      BGA) "Mobile South" south bridge chip for state-of-the-art 
      mobile applications
o   High Integration
    - Single chip implementation for 64-bit Socket-7-CPU, 64-bit 
      system memory, 32-bit PCI and 32-bit AGP interfaces
    - Apollo MVP3  Chipset: VT82C598MVP system controller and 
      VT82C586B PCI to ISA bridge
    - Chipset includes UltraDMA-33 EIDE, USB, and Keyboard / PS2-Mouse 
      Interfaces plus RTC / CMOS on chip
o   High Performance CPU Interface
    - Supports all Socket-7 processors including 64-bit Intel Pentium/ 
      Pentium with MMX, AMD 6k86 (K6), Cyrix/IBM 6x86 / 6x86MX, and 
      IDT/Centaur C6 CPUs
    - 66 / 75 / 83 / 100 MHz CPU external bus speed (internal 300MHz 
      and above)
    - Built-in deskew DLL (Delay Lock Loop) circuitry for optimal skew 
      control within and between clocking regions
    - Cyrix/IBM 6x86 linear burst support
    - AMD 6k86 write allocation support
    - System management interrupt, memory remap and STPCLK mechanism
o   Advanced Cache Controller
    - Direct map write back or write through secondary cache
    - Pipelined burst synchronous SRAM (PBSRAM) cache support
    - Flexible cache size:  0K / 256K / 512K / 1M / 2MB
    - 32 byte line size to match the primary cache
    - Integrated 8-bit tag comparator
    - 3-1-1-1-1-1-1-1 back to back read timing for PBSRAM access up to 
      100 MHz
    - Tag timing optimized (less than 4ns setup time) to allow 
      external tag SRAM implementation for most flexible cache 
      organization
    - Sustained 3 cycle write access for PBSRAM access or CPU to 
      DRAM & PCI bus post write buffers up to 100 MHz
    - Supports CPU single read cycle L2 allocation
    - System and video BIOS cacheable and write-protect
    - Programmable cacheable region
o   Full Featured Accelerated Graphics Port (AGP) Controller
    - Synchronous and pseudo-synchronous with the host CPU bus with 
      optimal skew control
        PCI    AGP    CPU     DRAM    Mode
        33MHz  66MHz  100MHz  100MHz  3x synchronous          *1
        33MHz  66MHz  83MHz   83MHz   2.5x pseudo-synchronous *1
        30MHz  60MHz  75MHz   75MHz   2.5x pseudo-synchronous *1
        33MHz  66MHz  66MHz   66MHz   2x synchronous          *1
        33MHz  66MHz  100MHz  66MHz   3x synchronous          *2
        33MHz  66MHz  83MHz   66MHz   2.5x pseudo-synchronous *2
        30MHz  60MHz  75MHz   66MHz   2.5x pseudo-synchronous *2
        33MHz  66MHz  66MHz   66MHz   2x synchronous          *2
        *1 DRAM uses CPU clock, *2 DRAM uses AGP clock
    - AGP v2.0 compliant (1x and 2x transfer modes)
    - Supports SideBand Addressing (SBA) mode (non-multiplexed 
      address/data)
    - Supports 133MHz 2X mode for AD and SBA signalling
    - Pipelined split-transaction long-burst transfers up to 533 MB/
      sec
    - Eight level read request queue
    - Four level posted-write request queue
    - Thirty-two level (quadwords) read data FIFO (128 bytes)
    - Sixteen level (quadwords) write data FIFO (64 bytes)
    - Intelligent request reordering for maximum AGP bus utilization
    - Supports Flush/Fence commands
    - Graphics Address Relocation Table (GART)
    - One level TLB structure
    - Sixteen entry fully associative page table
    - LRU replacement scheme
    - Independent GART lookup control for host / AGP / PCI master 
      accesses
    - Windows 95 OSR-2 VXD and integrated Windows 98 / NT5 miniport 
      driver support
o   Concurrent PCI Bus Controller
    - PCI buses are synchronous / pseudo-synchronous to host CPU bus
    - 33 MHz operation on the primary PCI bus
    - 66 MHz PCI operation on the AGP bus
    - PCI-to-PCI bridge configuration on the 66MHz PCI bus
    - Supports up to five PCI masters
    - Peer concurrency
    - Concurrent multiple PCI master transactions;  i.e., allow PCI 
      masters from both PCI buses active at the same time
    - Zero wait state PCI master and slave burst transfer rate
    - PCI to system memory data streaming up to 132Mbyte/sec
    - PCI master snoop ahead and snoop filtering
    - Six levels (double-words) of CPU to PCI posted write buffers
    - Byte merging in the write buffers to reduce the number of PCI 
      cycles and to create further PCI bursting possibilities
    - Enhanced PCI command optimization (MRL, MRM, MWI, etc.)
    - Forty-eight levels (double-words) of post write buffers from PCI 
      masters to DRAM
    - Sixteen levels (double-words) of prefetch buffers from DRAM for 
      access by PCI masters
    - Supports L1/L2 write-back forward to PCI master read to minimize 
      PCI read latency
    - Supports L1/L2 write-back merged with PCI master post-write to 
      minimize DRAM utilization
    - Delay transaction from PCI master reading DRAM
    - Read caching for PCI master reading DRAM
    - Transaction timer for fair arbitration between PCI masters 
      (granularity of two PCI clocks)
    - Symmetric arbitration between Host/PCI bus for optimized system 
      performance
    - Complete steerable PCI interrupts
    - PCI-2.1 compliant, 32 bit 3.3V PCI interface with 5V tolerant 
      inputs 
o   Advanced High-Performance DRAM Controller
    - DRAM interface synchronous with host CPU (66/75/83/100 MHz) or 
      AGP (66MHz) for most flexible configuration
    - Concurrent CPU and AGP access
    - FP, EDO, and SDRAM
    - 66MHz and 100MHz (PC100) SDRAM support
    - Different DRAM types may be used in mixed combinations
    - Different DRAM timing for each bank
    - Dynamic Clock Enable (CKE) control for SDRAM power reduction in 
      mobile and desktop systems
    - Mixed 1M / 2M / 4M / 8M / 16MxN DRAMs
    - 6 banks up to 768MB DRAMs
    - Flexible row and column addresses
    - 64-bit data width only
    - 3.3V DRAM interface with 5V-tolerant inputs
    - Programmable I/O drive capability for MA, command, and MD signals
    - Optional bank-by-bank ECC (single-bit error correction and 
      multi-bit error detection) or EC (error checking only) for DRAM 
      integrity
    - Two-bank interleaving for 16Mbit SDRAM support
    - Two-bank and four bank interleaving for 64Mbit SDRAM support
    - Supports maximum 8-bank interleave (i.e., 8 pages open simultan-
      eously);  banks are allocated based on LRU
    - Seamless DRAM command scheduling for maximum DRAM bus utilization
      (e.g., precharge other banks while accessing the current bank)
    - Four cache lines (16 quadwords) of CPU/cache to DRAM write 
      buffers
    - Four quadwords of CPU/cache to DRAM read prefetch buffers
    - Concurrent DRAM writeback
    - Read around write capability for non-stalled CPU read
    - Burst read and write operation
    - 5-2-2-2-2-2-2-2 back-to-back accesses for EDO DRAM
    - 6-1-1-1-2-1-1-1 back-to-back accesses for SDRAM
    - BIOS shadow at 16KB increment
    - Decoupled and burst DRAM refresh with staggered RAS timing
    - Programmable refresh rate and refresh on populated banks only
    - CAS before RAS or self refresh
o   Mobile System Support
    - Independent clock stop controls for CPU / SDRAM, AGP, and PCI 
      bus
    - PCI and AGP bus clock run and clock generator control
    - VTT suspend power plane preserves memory data
    - Suspend-to-DRAM and Self-Refresh operation
    - New VIA BGA VT82C596 “Mobile South” south bridge chip available 
      soon for support of new mobile features
    - Dynamic clock gating for internal functional blocks for power 
      reduction during normal operation
    - Low-leakage I/O pads
o   Built-in NAND-tree pin scan test capability
o   3.3V, 0.35um, high speed / low power CMOS process
o   35 x 35 mm, 476 pin BGA Package

**VT8501       Apollo MVP4,Single-Chip 66-100MHz & AGP       <11/04/98...
**VT82C680     Apollo P6, Pentium-Pro Chip Set               <08/30/96...
**Support chips:
**VT82C505     Pentium/486 VL to PCI Bridge                  <05/30/94...
**VT82C586/A/B PCI Integrated Peripheral Controller          <10/13/96...
**VT82C596/A   Mobile PCI Integrated Peripheral Controller   <11/05/97...
**VT82C686A/B  PCI Super-I/O Integrated Peripheral Ctrl.     <02/10/98...
**Later P-Pro/II/III/Celeron...
**Later AMD...
**Other...
*VLSI...
*Western Digital...
*Winbond...
*ZyMOS...
*General Sources:...

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