October Release 

This file was compiled on 10 -95  

·  Reformatted and corrected the Processor Module Revision Summary  

·  Corrected Server Platforms Systems Overview TPS 

·  Corrected Server Modules and Baseboards TPS 

Xpress System / Baseboard Revision Summary 

Xpress Processor Module Revision Summary 

Latest Versions of Software 

ECO Histories 

AM0 BIOS History 

R0 Desktop BIOS History 

Board History 

Desktop System History 

Deskside LX/MX System History 

Software/Driver History 

AM0 BIOS History 

BIOS 19 AM0 

BIOS 18.AK0 and AM0 

BIOS 19 AM0 

About This Release 

o  BIOS 0.01.19.AM0) 

Features/Errata Fixed In This Release 

o  Fixes 256M and greater caching anomoly. 

o  Altered EISA function return codes to accomodate changes in installed memory size without invalidating all EISA data structures.  

o  Only Slot 0 function 0 returns 1 for choice 25, earlier BIOSs returned 1 for all slots and functions. (We are using S1/F1/C25 as a BIOS/ECU communications bit). 

o  DPT with IDE failure, root cause was fixed in the planar BIOS IDE code. 

o  Error code and screen management was re-worked to assure persistence of some error codes on the screen. 

o  Parity RAM failures are isolated and reported to the SIMM level. 

o  Base memory is cleared on warm boot. 

o  Fixed error loging that was broken in BIOS 18. 

o  Assure DX is zero before boot attempt. 

Features Included In This Release 

o  Changed to more performance oriented defaults in setup. 

o  Bypasses the "keyboard lock boot pause" when Network password feature is enabled. 

o  All Adaptec initialization code (with the exception of H/W disable) was removed from the BIOS. BIOS relies in the SCSI BIOS to correctly accomplish  

Known Errata With This Release 

o  None. 

Features Still To Be Added / Comments About This Release 

o  None. 

BIOS 18.AK0 and AM0 

About This Release 

1.  This is the release of BIOS 18 and provides individual BIOS tailored for each specific Xpress platform: 

  0.02.18.AK0  Deskside w/o SCSI 

2.  NOTE: X-Series System Configuration Disk, Release 2.9.1 or above must be used with this BIOS. 

Features/Errata Fixed In This Release 

1.  Warm boot failure when Windows 3.11/DOS 6.2 version of EMM386 installed. 

Features Included In This Release 

1.  PC+MP 1.1 specification compatibility implemented. 

Known Errata With This Release 

o  None. 

Features Still To Be Added / Comments About This Release 

o  None. 

R0 Desktop BIOS History  

BIOS 19.R0 

About This Release 

o  BIOS 0.01.19.R0 XPRESS  

Features/Errata Fixed In This Release 

o  Fixes 256M and greater caching anomoly. 

o  Altered EISA function return codes to accomodate changes in installed memory size without invalidating all EISA data structures.  

o  Only Slot 0 function 0 returns 1 for choice 25, earlier BIOSs returned 1 for all slots and functions. (We are using S1/F1/C25 as a BIOS/ECU communications bit). 

o  DPT with IDE failure, root cause was fixed in the planar BIOS IDE code. 

o  Error code and screen management was re-worked to assure persistence of some error codes on the screen. 

o  Parity RAM failures are isolated and reported to the SIMM level. 

o  Base memory is cleared on warm boot. 

o  Fixed error loging that was broken in BIOS 18. 

o  Assure DX is zero before boot attempt. 

Features Included In This Release 

o  Changed to more performance oriented defaults in setup. 

o  Bypasses the "keyboard lock boot pause" when Network password feature is enabled. 

Known Errata With This Release 

o  None. 

Features Still To Be Added / Comments About This Release 

o  None. 

Board History 

Dual Pentium Processor Module 

BXCPUPENT90, 100 CPU 

BXCPUPENT60, 66 CPU 

BXCPU486DX266, SX25, SX33 

BXECCMEM 

Deskside/MX - Premium 

PBA 621053 (Deskside /MX, /LX) 

PBA 519610 (Desktop) 

Processor Module  

All Xpress CPU Modules Class II 

Current Implementation Date: 10/95 

Add CE certification mark to all BXCPU PBAs. New changes are required under European standards for continuing shipment of products into the European market. This CE logo change will be in effect by January of 1996 in all XPRESS CPU Modules 

Dual Pentiumä Processor Module - Class III 

Implemented 1/95 

The Software Kit was deleted because all current products ship with updated BIOS. Also, the operating systems now have mulitprocessing drivers included in their software. 

Pentium Processor Module changing to fused tantalium capacitors - Class III 

Current Implementation Date: Implemented 

To improve module reliability fused tantalium capacitors will now be used. 

Flat Heatsink on all CPU Modules - Class III 

Current Implementation Date: Implemented 5/94 

The cavity heatsink is being replaced with one that has a flat bottom, this is being done to improve manufacturing quality. 

BXCPUPENT90, 100 CPU  

Note: Schematic for this product is was created by ECO 5519509, part number 631683 from 624149. The CAD tool used for the original schematic is no longer available, so 631683 is not created electronically. 

BXCPUPENT90, 100 CPU Stepping Change (B5) - Class III 

Implementation Date: 1/95 

Fully enables multi-processing, fixes the floating point flaw, and increases the yield to 90 MHz. 

BXCPUPENT90, 100 CPU Stepping Change (C2) - Class III 

Implementation Date: Not tracked 

Eliminates gold heat-spreader. 

BXCPUPENT90, 100 FAB Changes - Class III 

Current Implementation Date: 2/95 

Buries the blue wire 

BXCPUPENT90, 100 Memory Write-Through Fix - Class II 

Implemented 11/94 

Implements a fix to prevent the possibility of memory corruption in some applications when the board cache is configured for write-through mode and the application does multiple partial writes to memory. There are no problems with write-back mode. 

BXCPUPENT90, 100 SAK Kit Deleted - Class III 

Implemented 12/94 

BIOS 19 is now being shipped with product. This special kit with the BIOS is no longer needed. 

BXCPUPENT60, 66 CPU  

BXCPUPENT60, 66 CPU Stepping Change (D1) - Class III 

Implementation Date: 1/95 

Incorporates new stepping of processor, which eliminates C1 step errata, fixes the floating point flaw, and improves manufacturability. 

Pentium Processor Module changing to fused tantalium capacitors - Class III 

Current Implementation Date: Implemented 

To improve module reliability fused tantalium capacitors will now be used. 

Flat Heatsink on all CPU Modules - Class III 

Current Implementation Date: Implemented 5/94 

The cavity heatsink is being replaced with one that has a flat bottom, this is being done to improve manufacturing quality. 

BXCPU486DX266, SX25, SX33  

BXCPU486DX266, SX25, SX33 CPU stepping change (SL enhanced) - Class III 

Implemented, No PBA Change. 

Incorporates new stepping of processor, which eliminates CPU errata and improves manufacturability. 

BXECCMEM 

BXECCMEM0 - Class II 

Current Implementation Date: 8/95 

New fab to reduce noise which will allow Intel to qualify more SIMM vendors on Xpress &  

Xtended Xpress baseboards. 

BXECCMEM0 - Class III 

Current Implementation Date: 5/95 

Add 470pf capacitor for Xtended Xpress noise reduction.. 

BXECCMEM0 Adding Windows NT v3.1 Capability - Class II 

Current Implementation Date: 2/95 

Also updating NT & SCO drivers to lock out external memory cycles during an ECC Error Memory Scrubbing Cycle. OS2, Netware 4.1, and Unixware 2.0 will be dropped until the ECC Error Memory Scrubbing Cycle is fixed. 

Deskside/MX - Premium 

New Version MECA ASIC - Class I 

Implemented 6/94 

The MECA ASIC has been revised to support ECC memory and Fast EISA and now is in full production on the following product codes, XBASE8TE16F-C and XLXBASE8TE16F. This revision adds full support for Type C EISA slave DMA transfers. IMPORTANT NOTE: Boards with MECA 3 must use BIOS 17 or higher 

All MX and LX baseboards with integrated SCSI are now being built with full ECC memory support. If the use of ECC memory is required, it is important to verify the version of baseboard by using the PBA number, which can be found printed on the shipping carton label. In addition there is a utility available on the BBS (MECATEST.EXE) which can be used to determine if a system supports ECC memory or not.  

PBA 621053 (Deskside /MX, /LX) 

New Stepping of Adaptec AIC-7770 SCSI Controller (8-slot -C baseboards only) - Class I 

Current Implementation Date: Implemented 6/94 

A new Rev. E stepping of the integrated SCSI controller provides a performance improvement over the current Rev. C controller. To fully support this new controller, there is a new version of the system BIOS (1.00.17.AM0), a new EISA Configuration Utility (version 2.9.1), and new SCSI drivers. The new PBA number for the 8-slot -C baseboard will be 621053-001. 

The AIC-7770E(rev.E) has the same form, fit, and function as its predecessor, the AIC-7770C. The AIC-7770E is Software Manager and Device Driver compatible to the AIC-7770C. It has been thoroughly and rigorously tested for both compatibility and reliability. The enhancements are: 

·  SCB (SCSI Command Block) swapping supported 

·  Wide and Differential SCSI supported 

·  Operating System support for NetWare(3.11, 3.12, 4.X), OS/2 2.X,  

·  Windows NT 3.1, SCO UNIX 3.2.4, USL SVR 3.2.4, and Unixware 1.1 

PBA 519610 (Desktop) 

New Version MECA ASIC - Class I 

Implemented 9/94 

The MECA ASIC has been revised to support ECC memory and Fast EISA. This revision adds full support for Type C EISA slave DMA transfers. IMPORTANT NOTE: Boards with MECA 3 must use BIOS 17 or higher. 

Remove Western Digital 16C552, add Texas Instruments 16C552, add Filter Caps - Class I 

Current Implementation Date: Implemented 8/93 

Due to errata within the Western Digital 16C552 serial port controller, it is being removed from the Approved Materials List. Texas Instruments is now the only supplier for this component. In addtion, 12 filter capacitors are being added to the serial port modem status lines to eliminate any signal noise introduced by serial devices connected to the port. 

New version Xpress 8-slot baseboard - Class I 

Implemented 

A new version of the Xpress 8-Slot baseboard incorporates an Adaptec 7770 dual-channel SCSI controller onto the baseboard. All eight EISA slots now will be bus-masters and the new board will now support Symetric Multi-Processing. This board will come in two versions: a SCSI version for the Deskside/MX (PBA 540374-007 and BIOS 1.00 11.AM0) and a non-SCSI version for the Xpress/LX (PBA 519800-007 and BIOS 1.00 08.AK0, switching to 1.00 12.AK0 in August). 

Desktop System History 

(in reverse chronological order) 

New 10- Pack Shipping Containers for Servers 

Current Implementation Date 10/95 

The new 10-pack containers will provide an equivalent (if not superior) level of protection to the previous containers, and a smaller size. The smaller size will aid in airfreight savings. In addition, the packaging techniques, can be implemented uniformly across Intel's sites.  

Customers will be able to tell the difference by comparing the boxes: they are different in size. Another way is to examine the inside of the 10-pack boxes; they will have a large corrugated tray inside the top flaps ; instead of, a large slab of foam . Another way is that the boxes will have a large black cross imprinted on the end panels; the cross is intended to assist on label placement. 

-For boards in the 13 x 15" and 10x13" form factors, the former 10-packs are changed to a new container. 

-For boards in the 5x7" form factor, the former 20-pack are changed to a new 10-pack container. 

-For boards in the 13x15" form factor, an alternate single pack is added. 

-For boards in the 10x13" form factor, an alternate single-pack is added. 

-For boards in the 5x12" form factor, an alternate single-pack is added. 

-For boards in the 5x7" form factor, an alternate single-pack is added. 

New power supply on XBASE6E4F-B, XBASE6E8F-B, XBASE6E16F-B Class I 

Current Implementation Date: 9/95 

A new power supply vendor, Sun Moon Star, has been qualified for the Xpress Desktop Systems. This power supply will be replacing the Teapo power supply which is no longer available. There is no physical, functional or form difference in the functionality of these supplies. 

All Xpress Systems Class II 

Current Implementation Date: 10/95 

Add CE certification mark to the system product/safety label. New changes are required under European standards for continuing shipment of products into the European market. This CE logo change will be in effect by January of 1996 in all XPRESS systems. 

Desktop Country Kit - Class III 

Current Implementation Date: est 4/95 

Updated WD driver which will eliminate video characters being dropped. Adding Qualified SIMM List. 

Logo Addition Class III 

Current Implementation Date: 7/94  

Two Intel Inside Logos will be added to the product. One approximately 1-inch label will be applied to the bezel in the upper left hand corner. On the shipping container, one approximately 3½-inch label will be placed near one of the two product code labels. 

New Version of Xpress Diagnostics - Class II 

Current Implementation Date: 5/94 

Enhancements to the XDIAGNOTICS version 1.46 package now provide diagnostic support for the Dual Pentiumä processor module, the new Pentium processor at iCOMPä index 735\90 MHz (P54C) module, the new IntelDX4ä module, and the new ECC memory module. 

New Version of Xpress Desktop 215 Watt Power Supply - Class I 

Current Implementation Date: Implemented 2/94 

A new version of the Teapo 215 watt power supply will be used in the Xpress Desktop system. This new supply incorporates changes to improve operability in the 220 voltage range. 

Floppy Drive will now have edge connector -- Class II 

Current Implementation Date: 12/93 

The 3½" TEAC floppy drive shipped with all Xpress systems will have an edge connector rather than DIN. A new floppy cable will be installed to support this drive.  

New Color of Floppy Access LED -- Class II 

Implemented 8/93 

The supplier for Xpress floppy drives has informed us that they have run out of amber colored LEDs and now will be shipping with green LEDs. They will switch back to amber once the supplier is able to again stock amber. If it's unaccaptable to receive floppy drives with green LEDs, please contact the nearest Intel Sales Office. 

Deskside LX/MX System History 

(in reverse chronological order). 

New 10- Pack Shipping Containers for Servers 

Current Implementation Date 10/95 

The new 10-pack containers will provide an equivalent (if not superior) level of protection to the previous containers, and a smaller size. The smaller size will aid in airfreight savings. In addition, the packaging techniques, can be implemented uniformly across Intel's sites.  

Customers will be able to tell the difference by comparing the boxes: they are different in size. Another way is to examine the inside of the 10-pack boxes; they will have a large corrugated tray inside the top flaps ; instead of, a large slab of foam . Another way is that the boxes will have a large black cross imprinted on the end panels; the cross is intended to assist on label placement. 

-For boards in the 13 x 15" and 10x13" form factors, the former 10-packs are changed to a new container. 

-For boards in the 5x7" form factor, the former 20-pack are changed to a new 10-pack container. 

-For boards in the 13x15" form factor, an alternate single pack is added. 

-For boards in the 10x13" form factor, an alternate single-pack is added. 

-For boards in the 5x12" form factor, an alternate single-pack is added. 

-For boards in the 5x7" form factor, an alternate single-pack is added. 

New power supply on XBASE6E4F-B, XBASE6E8F-B, XBASE6E16F-B Class I 

Current Implementation Date: 9/95 

A new power supply vendor, Sun Moon Star, has been qualified for the Xpress Desktop Systems. This power supply will be replacing the Teapo power supply which is no longer available. There is no physical, functional or form difference in the functionality of these supplies. 

All Xpress Systems Class II 

Current Implementation Date: 10/95 

Add CE certification mark to the system product/safety label. New changes are required under European standards for continuing shipment of products into the European market. This CE logo change will be in effect by January of 1996 in all XPRESS systems. 

Deskside LX/MX with SCSI Country Kit Changes - Class III 

Current Implementation Date: est 4/95 

Updated WD driver which will eliminate video characters being dropped. Adding Qualified SIMM List. 

Updated Windows NT 2.02S driver to fix problem with NT auto-detecting SCSI controller. 

Deskside LX without SCSI Country Kit Changes - Class III 

Current Implementation Date: 4/95 

Updated WD driver which will eliminate video characters being dropped. Adding Qualified SIMM List. 

Deskside/LX 230 watt Power Supply Class III 

Implemented 12/94 

Adds extra connector for a new chassis. Power Supply going from Rev 06 to Rev 07. 

Logo Addition Class III 

Current Implementation Date: 7/94  

Two Intel Inside Logos will be added to the product. One approximately 1-inch label will be applied to the bezel in the upper left hand corner. On the shipping container, one approximately 3½-inch label will be placed near one of the two product code labels. 

New Version of Xpress Diagnostics - Class II 

Current Implementation Date: 5/94 

Enhancements to the XDIAGNOTICS version 1.46 package now provide diagnostic support for the Dual Pentiumä processor module, the new Pentium processor at iCOMPä index 735\90 MHz (P54C) module, the new IntelDX4ä module, and the new ECC memory module. 

New Version of Deskside/LX Astec 230 Watt Power Supply - Class I 

Current Implementation Date: 5/94 

Enhancements to the Astec 230 watt power supply improve operation under high +12 volt loads. Some peripherals, such as CD-ROM drives, have high +12 volt inrush current. Changes in the +12 volt circuitry allow higher levels of inrush current to be tolerated by the power supply. 

Floppy Drive will now have edge connector -- Class II 

Current Implementation Date: 12/93 

The 3½" TEAC floppy drive shipped with all Xpress systems will have an edge connector rather than DIN. A new floppy cable will be installed to support this drive.  

New Color of Floppy Access LED -- Class II 

Implemented 8/93 

The supplier for Xpress floppy drives has informed us that they have run out of amber colored LEDs and now will be shipping with green LEDs. They will switch back to amber once the supplier is able to again stock amber. If it's unaccaptable to receive floppy drives with green LEDs, please contact the nearest Intel Sales Office. 

Software/Driver History 

Not available at this time 

IPTL Tested Product List 

Xpress Deskside/MX Premium Server 

This summary is from file EXPR613.doc, the full iPTL test report. This report is available. 

Related Topics: 

HARDWARE TESTING USED IN INTEROPERABILITY AND SYSTEMS 

OPERATING SYSTEMS AND HARDWARE USED IN NETWORK TESTING 

Software Used In All Testing, Including Operating Systems 

HARDWARE TESTING USED IN INTEROPERABILITY AND SYSTEMS  

OPERATING SYSTEMS AND HARDWARE USED IN NETWORK TESTING 

Software Used In All Testing, Including Operating Systems 

Approved Vendor List for all User Installable Parts 

(FaxBACK document 4143) 

Related Topics: 

Performance Upgrades 

External Cache Socket 

System Memory 

Video DRAM Memory 

XRAID4 Cache memory 

Performance Upgrades 

  OverDrive Processor Socket  i487 SX/25 coprocessor 

          i487 SX/33 coprocessor 

          OverDrive Processor; 50 MHz and 66 MHz versions 

External Cache Socket 

    IDT Cache Module (128 KB Direct Mapped Cache) 

    Intel Turbocache486Ô (64/128 KB Set Associative Cache) 

    Recommended Cache Static RAMs (Table A-1) 

  Table A-1. Recommended Cache Static RAMs. 

System Memory 

Baseboard SIMM Configuration Guide 

Intel Tested and Approved SIMM Vendor List 

Intel Tested or Customer Tested SIMM Vendor List 

Intel Tested SIMM Vendor List for BXECCMEM0 Only 

Known Incompatible SIMMs on the Baseboard, BXMEM0, or BXECCMEM0 Memory Modules 

Baseboard SIMM Configuration Guide 

Notes:  1.  JEDEC standard 36-bit, fast-page mode SIMM modules required. 

    2.  J0550 and J0551 socket sites are SIMM Bank 0. Same size and type SIMMs are required. 

    3.  J0650 and J0651 socket sites are SIMM Bank 1. Same size and type SIMMs are required. 

    4.  All possible memory combinations NOT shown. SIMM sizes obviously can be mixed. 

    5.  Similar memory design on the optional memory module, but with eight SIMM sockets. 

    6.  Standard default configuration for the Desktop platform.   

    7.  Standard default configuration for the Xpress/MX Premium server and Xpress/LX Mainstream server. 

    8.  Available default configuration for the Xpress/LX Mainstream server and Xpress/MX Premium server. 

The following tables list SIMMs that are known to be compatible with the specified Intel platforms. SIMMs that are not listed also should function properly as long as their specifications are compatible with the devices listed below. In general, SIMM devices that are faster than those specified for a given platform will work although no extra performance will be realized. The SIMM devices shown are categorized according to three levels of qualification: 

1. Intel Tested and Approved: The SIMM has been electrically tested by Intel engineering and is known to be compatible with the Xpress server basebaord, Xpress parity memory module, or Xpress ECC memory module. Rigerous envinronmental testing, voltage margin, shock, and vibration testing were conducted on these SIMM devices. In addition, the vendor has met or exceeded Intel's product change, quality control, and availablity requirements. The SIMM is on the Intel Approved Manufacturing List. 

2. Intel Tested: The SIMMs have been analyzed by the data sheet and have been electrically tested. A small sample ( normally 12 SIMMs) have been tested by Intel engineering across voltage and temperature margins on the Xpress baseboard and/or memory modules. The SIMMs are not on the Apporved Manufacturing list, but are considered appropriate for use in the Xpress server system. 

3. Customer Tested: The SMM has been electrically tested by an OEM customer and is reported to be compatible with the Xpess server platform system. 

Intel recommends that SIMMs listed as (1) Intel Approved and Tested or (2) Intel Tested be used to ensure reliable system operation. SIMMs not listed or listed as (3) Customer Tested can be used; but, in the event of unreliable system operation, the SIMMs should be replaced with SIMMs tested by Intel (1 or 2) to determine whether the SIMMs are causing the problem. 

IMPORTANT NOTE 

SIMM devices with gold contacts should NOT be placed into SIMM sockets with tin-lead contacts or vice-versa. Mixing dissimilar metal contact types has been shown to result in unreliable memory operation. For more information, see FaxBack document 4229. Intel Corporation makes no warranty for the use of its products and assumes no responsibility for any errors which may appear in this document nor does it make a commitment to update the information contained herein. Intel Corporation retains the right to make changes to these specifications at any time, without notice. Product and corporate names listed in this document may be trademarks of their respecitive companies. 

Vendor Contacts (phone numbers are provided for convenience and may change without notice. Current as of 1/95). 

Centon  516-471-7700 

Fujitsu  408-922-9000* 

Enhanced Technology  818-343-3066 

Hyundai  408-473-9200 

Kelly Micro Systems  800-854-3900  

Micron  208-368-3900* 

MPM  800-899-4676 

NEC  415-960-6000* 

Samsung  408-954-7000* 

Simple Technologies  714-558-1120 

Smart Modular  510-623-1231 

Texas Instruments  214-644-5580 

Toshiba  503-629-0818* 

  *ask for the number of a representative in your area 

Intel Tested and Approved SIMM Vendor List 

Baseboard and BXMEM0 256K X 36 (1MB per SIMM) 

Tin-lead contacts 

Baseboard and BXMEM0 512K X 36 (2MB per SIMM) 

Tin-lead contacts 

Baseboard, BXMEM0, or BXECCMEM0 1M X 36 (4MB per SIMM) 

Tin-lead contacts 

Baseboard, BXMEM0, or BXECCMEM0 2M X 36 (8MB per SIMM) 

Tin-lead contacts 

Baseboard, BXMEM0, or BXECCMEM0 4M X 36 (16MB per SIMM) 

Tin-lead contacts 

Baseboard, BXMEM0, or BXECCMEM0 8M X 36 (32MB per SIMM)  

Tin-lead contacts 

$$ Intel Tested or Customer Tested SIMM Vendor List## 959W.9KK Intel Tested or Customer Tested SIMM Vendor ListIntel Tested or Customer Tested SIMM Vendor List 

BXMEM0 1MB, 2MB, 4MB, 8MB, 16MB, and 32MB SIMMS 

Tin-lead contacts 

Intel Tested SIMM Vendor List for BXECCMEM0 Only 

512K X 36 (2MB per SIMM)  

Tin-lead contacts 

1M X 36 (4MB per SIMM)  

Tin-lead contacts 

2M X 36 (8MB per SIMM)  

Tin-lead contacts 

4M X 36 (16MB per SIMM) 

Tin-lead contacts 

8M X 36 (32MB per SIMM) 

Tin-lead contacts 

Known Incompatible SIMMs on the Baseboard, BXMEM0, or BXECCMEM0 Memory Modules 

While the Xpress Bus Interface is capable of transferring data to SIMM speeds ranging between 50 ns and 80 ns, currently the Xpress-to-EISA Controller (MECA) and Xpress DRAM Controller (RCA) are not able to detect the various SIMM speeds. Since the current 72-pin SIMM presence detection bits are limited to two pins, they support only four types of SIMMs (1MB, 2MB, 4MB, and 8MB SIMMs). JEDEC has not yet ratified signal definitions for 50 ns DRAM parts, 4Mb x 36 or 8Mb x 36 DRAM technology. As 16M-bit DRAMs become available, the SIMM presence detection scheme for the 16 MB and 32 MB SIMMs will replace those for 1 MB and 2 MB. For the 16 MB and 32 MB SIMMs to be used, there must be a special detection scheme. Currently there is no standard, but there is a JEDEC proposal. Until this new standard is recognized by the memory manufacturers, Xpress Desktop and Deskside systems will support 80 ns SIMM single- and double-sided modules in accordance with the existing JEDEC standard. Table A-4 describes the level for each Presence Detect pin on the SIMM using the current JEDEC Proposal: 

Table A-4. Proposed JEDEC standard SIMM Pinout. 

Notes:  1. Pin 66 should be a No-Connect (NC) on the SIMM. This pin is currently set by changing the SIMM0 or SIMM1 jumpers on the Xpress baseboard. This pin definition is following an IBM proposal to the JEDEC committee. 

  2.  Pins 69 and 70 are electrically connected on the baseboard and each SIMM module is required to have one or both of these pins connected to ground. For example, 60 ns Toshiba SIMMs do not have either of these pins grounded and will not work in Xpress. 

  3. NC pins must be tied to Vcc through pull-up resistors. 

Video DRAM Memory 

Video DRAM memory can be upgraded using four 256K x 4, 60 ns, DIP components. While some DRAM parts rated at 70 ns will function in Xpress platforms, Intel does not warrant the use of these 70 ns parts, or assume any liability concerning the use of these parts. Also note that the Texas Instruments DRAM part has a test function (pin 5) which must be disconnected or biased at a voltage greater than Vcc to be used in the Xpress system baseboard. 

Table A-6. Recommended Video DRAM Vendors for Xpress Platforms. 

XRAID4 Cache memory 

The XRAID4 SCSI disk controller is based on the Intel I960 32-bit RISC processor. This processor controls all functions of the SCSI controller, SCSI/EISA bus transfers, RAID processing, error recovery and disk cache memory accesses. The disk cache memory on the XRAID4 add-in card can be configured to be 4, 16, or 64 MB using four 70 ns, x9 SIMMs. 

Table A-7. Recommended XRAID4 Disk Cache SIMMs. 

Readme Files 

Video Drivers V4.3B for Windows 

Video Drivers V4.3A for DOS 

Video Drivers V4.3B for Windows 

The following is the "readme.txt" file found on the Video Drivers V4.3B for Windows 3.1 disk, copyright Western Digital Corp. Intel part number 634007-001 

   Western Digital Accelerator Card for Windows 

     Windows 3.1 Driver List 

INSTALLATION INSTRUCTIONS 

Place the Western Digitial driver diskette in drive A:. Under Windows Program  

Manager, click on "File" and then on "Run". Type "A:\WDSETUP" for the 

Command Line and then click on OK.  

From WDSETUP program, set the Driver Directory to A. Select the desired  

drivers and click on "Add Driver". Close this Window when it is done.  

Then chose the desired driver resolution and click on "Restart Windows". 

To change the drivers at later date, click on the Western Digital icon, 

chose a new driver, and click on "Restart Windows". 

DISK FILE LIST 

The following is a list of the files on this disk. These files are in a 

compressed format and are intented for use with WDSETUP or Microsoft's setup 

programs. Any files which are installed without WDSETUP or Microsoft's setup 

must be decompressed with the Microsoft Utility Expand. 

Windows 3.1 Drivers 

  WD640_4.DRV 640x480 16-color 

  MMWD480.DRV 640x480 256-color(512K) 

  WD31_8.DRV 640x480 256-color(Small Font) 

  WD31_8.DRV 640x480 256-color(Large Font) 

  WD800_4.DRV 800x600 16-color 

  PVGA600.DRV 800x600 256-color(512K) 

  WD31_8.DRV 800x600 256-color(Small Font)  

  WD31_8.DRV 800x600 256-color(Large Font)  

  WD1024_4.DRV 1024x768 16-color 

  WD31_8.DRV 1024x768 256-color(Small Font) 

  WD31_8.DRV 1024x768 256-color(Large Font) 

  WD1280_4.DRV 1280x1024 16-color 

  WD960_4.DRV 1280x960 16-color 

  P32K480.DRV 640x480 32K-color 

  P32K600.DRV 800x600 32K-color 

  P64K480.DRV 640x480 64K-color 

  P64K600.DRV 800x600 64K-color 

  WD31_24.DRV 640x480 16M-color 

WDSETUP Files 

  WDSETUP.BIN 

  WDSETUP.EXE 

  WDSETUP.HLP 

  W1311H.INF 

  W1315H.INF 

  W1315T.INF 

  W1311T.INF 

  W1311S.INF 

  W1315S.INF 

Microsoft Setup Files 

  OEMDISK1 

  OEMSETUP.INF 

  VGALOGO.LGO 

  VGALOGO.RLE 

Windows 3.1 Fonts 

  8514FIX.FON 

  8514OEM.FON 

  8514SYS.FON 

  CGA40WOA.FON 

  CGA80WOA.FON 

  COURE.FON 

  COURF.FON 

  DOSAPP.FON 

  EGA40WOA.FON 

  EGA80WOA.FON 

  SERIFE.FON 

  SERIFF.FON 

  SMALLE.FON 

  SMALLF.FON 

  SSERIFE.FON 

  SSERIFF.FON 

  SYMBOLE.FON 

  SYMBOLF.FON 

  VGAFIX.FON 

  VGAOEM.FON 

  VGASYS.FON 

Windows 3.1 support files 

  PVGA.GR2 

  V7VGA.GR2 

  VDDVGA.386 

Licensed by Western Digital for use by its customers only. 

Copyright (C) 1989-1993 Western Digital Corporation. All rights reserved.